As semiconductor and photovoltaic manufacturing processes advance, traditional chemical cleaning methods are increasingly being challenged—not only in performance but also in environmental impact. The imperative for higher yields, finer feature sizes, and sustainable processes is making the adoption of ozone-based wet cleaning systems no longer optional but essential for leading manufacturers.
Ozone-water cleaning is emerging as a high-performance alternative that meets ultra-clean surface requirements while significantly reducing hazardous chemical use and environmental liability.
The Need for Ultra-Clean Surfaces
In semiconductor and photovoltaic manufacturing, surface cleanliness directly impacts device performance, yield, and long-term reliability. Even trace levels of organic residues, inorganic contaminants, or particulate matter can compromise production outcomes.
These requirements apply across:
- Semiconductor fabrication facilities
- Solar panel manufacturing plants
- Precision component cleaning applications
As semiconductor nodes shrink below 5 nanometres and photovoltaic cell efficiencies soar, manufacturers demand cleaning technologies that combine unmatched precision with protection—delivering clean results without the risk of surface damage or unwanted residue.
Why Ozone-Water Systems Are Gaining Preference
Ozone-water wet cleaning systems combine superior cleaning performance with environmental sustainability, a combination that conventional chemical processes struggle to match.
Key advantages include:
- Effective removal of organic and inorganic contaminants
- Minimal hazardous waste generation
- Elimination or reduction of aggressive chemical usage
- No residual chemical contamination after treatment
In practical applications, ozone-water cleaning systems have demonstrated 25–40% improvements in particle removal efficiency compared to traditional chemical-based systems, while supporting chemical-reduction targets across advanced manufacturing environments.
The Role of Advanced System Design
Recent advances in high-concentration ozone generation, precision flow control, and real-time process monitoring have significantly expanded the feasibility of ozone-water cleaning systems in high-volume manufacturing.
Modern systems integrate:
- Automated fab management interfaces
- High-efficiency ozone dissolution chambers
- Precision control of flow rate, temperature, and exposure time
- Continuous monitoring to ensure process stability
These developments make ozone-water cleaning systems suitable for both advanced semiconductor fabrication and photovoltaic production environments.
High-Flow vs Low-Flow Ozone-Water Systems
High-Flow Systems
High-flow ozone-water systems account for approximately 54% of the market in 2025, delivering flow rates over 20 litres per minute, and are tailored for high-throughput settings.
They are widely used in:
- 300 mm semiconductor wafer production lines
- Automated, multi-wafer batch-processing facilities
- High-volume photovoltaic manufacturing plants
Key advantages include:
- Processing capacity of 50–100 wafers per hour
- 20–30% lower per-wafer cleaning costs in volume production
- Seamless integration with existing fab automation
- Scalability through parallel system installation
- Low-Flow and Specialised Systems
Low-flow ozone-water systems account for about 38% of the market and are chosen for applications that require precise ozone concentration control, single-wafer processing, or laboratory and pilot production environments.
- Precise ozone concentration control
- Single-wafer processing
- Laboratory-scale or pilot production environments
Approximately 8% of the market comprises customised ozone-water systems for specialised applications, pilot facilities, and unique cleaning requirements.
Application Trends Across Industries
Semiconductor Manufacturing
Semiconductor applications represent about 68% of all ozone-water system usage, underscoring the need for ultra-clean wafer surfaces in this sector.
Ozone-water systems are widely adopted in:
- Logic and memory chip fabrication
- Compound semiconductor manufacturing
- Advanced packaging facilities
Typical semiconductor processes require 15–25 cleaning steps per wafer, with contamination limits often below 10 particles per square centimetre.
Photovoltaic Manufacturing
The photovoltaic sector use comprises roughly 32% of the ozone-water system market, with deployment in silicon wafer texturing, post-diffusion cleaning, transparent conductive oxide preparation, and module component cleaning.
- Silicon wafer texturing
- Post-diffusion cleaning
- Transparent conductive oxide surface preparation
- Module component cleaning
Optimised ozone-water cleaning can deliver 2–5% improvements in cell efficiency, supporting industry efforts to enhance performance and reduce manufacturing losses.
Market Drivers and Growth Outlook
Global semiconductor manufacturing capacity is surging at 15–20% annually in top regions, setting the stage for advanced cleaning technologies to become the backbone of yield and quality improvements at the most competitive production nodes.
At the same time, environmental regulations are pushing manufacturers to reduce or eliminate hazardous chemicals such as:
- Sulfuric acid
- Hydrogen peroxide
- Ammonium hydroxide
Ozone-water cleaning systems address these pressures by delivering equivalent or superior cleaning performance while removing the burden of hazardous waste disposal and regulatory compliance costs.
Photovoltaic manufacturing expansion, particularly in China, Southeast Asia, and Europe, further accelerates adoption, with investments in production capacity exceeding USD 50 billion through 2030.
Challenges and Implementation Considerations
Despite clear advantages, the successful deployment of ozone-water systems requires thorough evaluation and expert engineering—a small investment for manufacturers determined to maximise their competitive edge.
Key considerations include:
- Capital investment, typically ranging from USD 300,000 to USD 2,000,000 per system
- Process integration complexity, requiring precise control of ozone concentration, flow rate, temperature, and exposure time
- Material compatibility: high ozone concentrations may affect sensitive materials, including some low-k dielectrics and metal films.
Successful implementation depends on application-specific system design, process optimisation, and ongoing technical support.
Ozone-based wet cleaning systems are increasingly favoured in semiconductor and photovoltaic manufacturing for their ability to deliver ultra-clean surfaces, chemical reduction, and environmental compliance.
As device architectures grow in complexity and regulatory pressures tighten, ozone-water systems stand out as the definitive, technically robust solution—provided they are engineered, controlled, and integrated with precision by those committed to operational excellence.
At Biozone Manufacturing, our ozone-water cleaning systems are meticulously engineered for precision control, scalability, and unwavering process reliability—empowering advanced manufacturing environments to achieve uncompromising performance, compliance, and leadership.